Vishay Isolated TrenchFET 2 Type P-Channel Power MOSFET, 2.3 A, 30 V Enhancement, 6-Pin TSOP

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  • 2026年11月02日 發貨
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RS庫存編號:
165-6919
製造零件編號:
SI3993CDV-T1-GE3
製造商:
Vishay
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品牌

Vishay

Channel Type

Type P

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

2.3A

Maximum Drain Source Voltage Vds

30V

Package Type

TSOP

Series

TrenchFET

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

188mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

1.4W

Typical Gate Charge Qg @ Vgs

5.2nC

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

150°C

Maximum Operating Temperature

-55°C

Transistor Configuration

Isolated

Standards/Approvals

No

Height

1mm

Length

3.1mm

Width

1.7mm

Number of Elements per Chip

2

Automotive Standard

No

COO (Country of Origin):
CN

Vishay TrenchFET Series Power MOSFET, 30V Maximum Drain Source Voltage, 2.3A Maximum Continuous Drain Current - SI3993CDV-T1-GE3


This power MOSFET is a surface-mount P-channel switching transistor designed for compact, low-power applications. It operates within a modest voltage range and is intended for efficient switching duties where a dual-element, isolated transistor configuration is required. The component is supplied in a slim TSOP package suited to board-level integration in electronic control systems.

Features and Benefits:


• 30V maximum drain voltage enables safe low-voltage switching
• 2.3A continuous drain current supports moderate load currents
• 188mΩ low RDS(on) reduces conduction losses
• 5.2nC typical gate charge affords fast gate switching
• 1.4W power dissipation allows duty-cycled operation
• Isolated dual-element design enables split-channel implementations

Applications


• Suitable for low-voltage motor control in automation modules
• Ideal for power switching in Compact power supplies
• Used for load switching in embedded control systems
• Can be used for polarity control in battery management circuits

What thermal range can be expected during operation?


The device is rated to operate between -55°C and 150°C, allowing use across extended temperature environments.

How does the package support board assembly?


The TSOP surface-mount format with six pins facilitates automated placement and soldering on densely populated boards.

Can the gate handle higher control voltages?


The gate should not exceed 20V maximum to avoid damaging the gate oxide and to maintain specified performance.

Does the device support multi-element configurations on a single chip?


Yes, it contains two elements per chip in an isolated configuration, enabling paired switching arrangements without external isolation.

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