Vishay EF Type N-Channel Power MOSFET, 40 A, 650 V Depletion, 8-Pin PowerPAK 10 x 12 SIHK055N60EF-T1GE3

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包裝方式:
RS庫存編號:
252-0264
製造零件編號:
SIHK055N60EF-T1GE3
製造商:
Vishay
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品牌

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

40A

Maximum Drain Source Voltage Vds

650V

Package Type

PowerPAK 10 x 12

Series

EF

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.05mΩ

Channel Mode

Depletion

Maximum Power Dissipation Pd

236W

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.2V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

90nC

Maximum Operating Temperature

150°C

Length

6.15mm

Standards/Approvals

RoHS

Width

5.15mm

Automotive Standard

AEC-Q101

Vishay Series EF Power MOSFET, 650V Drain Source Voltage, 40A Drain Current - SIHK055N60EF-T1GE3


This power MOSFET is a high-voltage switching transistor intended for demanding power conversion and control environments. It is a surface-mount N-channel depletion device that operates across a broad thermal range and is suited to applications requiring high-voltage handling, substantial continuous current and controlled gate-drive behaviour.

Features and Benefits:


• 650V drain-source rating enables high-voltage switching capability
• 40A continuous drain current supports heavy-load operation
• 0.05mΩ Rds(on) minimises conduction losses at high currents
• 90nC typical gate charge allows predictable switching energy
• 236W maximum power dissipation handles significant thermal stress
• 20V gate tolerance permits robust gate-drive margins

Applications


• Used with industrial power converters and inverters
• Suitable for high-voltage motor drive stages
• Ideal for DC-DC conversion in heavy-duty systems
• Can be used for traction or automotive power modules
• Used for high-power switch arrays in energy systems

What thermal extremes can the device endure in service?


It is rated to operate from -55°C up to +150°C, permitting use in environments with wide temperature variation.

How is the component mounted on a board and what package is provided?


The device is supplied in a PowerPAK 10x12 surface-mount package designed for low-inductance PCB mounting and efficient thermal contact.

What regulatory or industry readiness does it offer for automotive use?


It meets AEC-Q101 requirements for semiconductor qualification suitable for automotive electronic systems.

What pin-count should designers expect when creating PCB footprints?


The component presents an 8-pin layout, which should be accommodated in the PCB land pattern for correct placement and routing.

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