Vishay E Type N-Channel Power MOSFET, 29 A, 600 V, 8-Pin PowerPAK 10 x 12 SIHK075N60E-T1-GE3
- RS庫存編號:
- 239-5381
- 製造零件編號:
- SIHK075N60E-T1-GE3
- 製造商:
- Vishay
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TWD284.00
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TWD298.20
(含稅)
訂單超過 $1,300.00 免費送貨
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- 2,050 件從 2026年8月10日 起裝運發貨
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|---|---|
| 1 - 49 | TWD284.00 |
| 50 - 99 | TWD276.00 |
| 100 - 249 | TWD268.00 |
| 250 - 999 | TWD259.00 |
| 1000 + | TWD253.00 |
* 參考價格
- RS庫存編號:
- 239-5381
- 製造零件編號:
- SIHK075N60E-T1-GE3
- 製造商:
- Vishay
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Vishay | |
| Product Type | Power MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 29A | |
| Maximum Drain Source Voltage Vds | 600V | |
| Package Type | PowerPAK 10 x 12 | |
| Series | E | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 0.08Ω | |
| Typical Gate Charge Qg @ Vgs | 41nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 167W | |
| Maximum Gate Source Voltage Vgs | 30V | |
| Forward Voltage Vf | 1.2V | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Vishay | ||
Product Type Power MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 29A | ||
Maximum Drain Source Voltage Vds 600V | ||
Package Type PowerPAK 10 x 12 | ||
Series E | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 0.08Ω | ||
Typical Gate Charge Qg @ Vgs 41nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 167W | ||
Maximum Gate Source Voltage Vgs 30V | ||
Forward Voltage Vf 1.2V | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
Vishay Series E Power MOSFET, 600V Drain Source Voltage, 29A Continuous Drain Current - SIHK075N60E-T1-GE3
This power MOSFET is a high-voltage, N‑channel semiconductor device designed for switching and power conversion in demanding electronic systems. It is suited to surface-mount applications where compact packaging and robust thermal performance are required, and complies with RoHS environmental restrictions.
Features and Benefits:
• 600V rating enables high-voltage switching capability
• 29A continuous drain current supports substantial load currents
• 0.08Ω Rds(on) delivers low conduction losses
• 167W power dissipation allows effective thermal handling
• 41nC typical gate charge permits controlled switching dynamics
• 30V gate tolerance provides broad gate-drive margin
• 29A continuous drain current supports substantial load currents
• 0.08Ω Rds(on) delivers low conduction losses
• 167W power dissipation allows effective thermal handling
• 41nC typical gate charge permits controlled switching dynamics
• 30V gate tolerance provides broad gate-drive margin
Applications
• Suitable for industrial motor-drive inverters
• Used with power supplies for server and telecoms equipment
• Ideal for DC-DC converters in renewable energy systems
• Can be used for high-voltage switch controllers in instrumentation
• Suitable for LED lighting drivers requiring high-voltage switches
• Used with power supplies for server and telecoms equipment
• Ideal for DC-DC converters in renewable energy systems
• Can be used for high-voltage switch controllers in instrumentation
• Suitable for LED lighting drivers requiring high-voltage switches
What mounting method is required for reliable electrical connection?
It is supplied in a low-profile PowerPAK 10x12 package intended for surface mounting to a PCB using solder pads for mechanical and thermal contact.
How wide is the operating temperature range for harsh environments?
The device is rated to operate from -55°C up to 150°C, allowing use across extreme ambient and elevated junction conditions.
What gate-drive considerations should be observed?
The maximum gate-source voltage is 30V, so gate-drive circuits must limit Vgs within this boundary and provide sufficient drive to achieve the specified gate charge of around 41nC.
How does the package support thermal dissipation?
The PowerPAK 10x12 format offers a thermal path through the package to the PCB, aiding the device in managing up to 167W of dissipation under appropriate board thermal design.
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