Infineon OptiMOS P Type P-Channel MOSFET, 1.5 A, 30 V Enhancement, 3-Pin SOT-23

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RS庫存編號:
165-8258
製造零件編號:
BSS314PEH6327XTSA1
製造商:
Infineon
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品牌

Infineon

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

1.5A

Maximum Drain Source Voltage Vds

30V

Package Type

SOT-23

Series

OptiMOS P

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

230mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

500mW

Typical Gate Charge Qg @ Vgs

2.9nC

Forward Voltage Vf

-1.1V

Maximum Operating Temperature

150°C

Length

2.9mm

Standards/Approvals

No

Height

1.3mm

Automotive Standard

AEC-Q101

COO (Country of Origin):
CN

Infineon OptiMOS P Series MOSFET, 30V Maximum Drain Source Voltage, 1.5A Maximum Continuous Drain Current - BSS314PEH6327XTSA1


This p-channel MOSFET serves as a compact surface-mount switching device for low-voltage power control in automotive and industrial electronics. Designed for enhancement-mode operation, it offers controlled conduction for power-path and load-switching tasks across a wide temperature range, making it suitable for demanding thermal environments.

Features and Benefits:


• 30V drain capability enables low-voltage system switching
• 230mΩ Rds(on) delivers efficient conduction for small loads
• 1.5A continuous drain current supports moderate current paths
• 2.9nC typical gate charge reduces switching energy losses
• 20V maximum gate-source rating allows flexible gate drive margins
• Automotive AEC‑Q101 qualification suits vehicle‑grade applications

Applications


• Suitable for battery management and protection circuits
• Ideal for load switching in automotive control modules
• Used with power rails in handheld and portable electronics
• Can be used for small-signal power switching in sensor nodes
• Suitable for surface-mount designs where board space is limited

What thermal extremes can it tolerate during operation?


It is specified to operate from -55°C up to 150°C, allowing use in environments with wide temperature variation.

How does the package influence board-level integration?


The SOT-23 surface-mount format permits compact placement and automated assembly on densely populated boards.

What power-handling constraints should designers consider?


The device dissipates up to 500mW, so adequate PCB copper and thermal layout are required to manage junction temperature under continuous load.

Which electrical limit governs gate drive selection?


Drive voltages must remain within ±20V relative to the source to avoid gate overstress and ensure reliable switching.

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