Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 0.635 mm Pitch, 4 Row, Shrouded
- RS庫存編號:
- 202-7908
- 製造零件編號:
- ADM6-60-01.5-L-4-2-A
- 製造商:
- Samtec
可享批量折扣
小計（1 件）*
TWD1,424.00
(不含稅)
TWD1,495.20
(含稅)
添加 1 件 件可免費送貨
最後的 RS 庫存
- 最終 153 個，準備發貨
單位 | 每單位 |
|---|---|
| 1 - 24 | TWD1,424.00 |
| 25 - 49 | TWD1,388.00 |
| 50 + | TWD1,367.00 |
* 參考價格
- RS庫存編號:
- 202-7908
- 製造零件編號:
- ADM6-60-01.5-L-4-2-A
- 製造商:
- Samtec
規格
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Series | ADM6 | |
| Product Type | PCB Header | |
| Current | 1.34A | |
| Pitch | 0.635mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 60 | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Series ADM6 | ||
Product Type PCB Header | ||
Current 1.34A | ||
Pitch 0.635mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 60 | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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