Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 644-469
- 製造零件編號:
- UDM6-40-4-01.5-L-A-TH-TR
- 製造商:
- Samtec
可享批量折扣
小計（1 件）*
TWD1,040.00
(不含稅)
TWD1,092.00
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 124 件準備從其他地點送貨
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單位 | 每單位 |
|---|---|
| 1 - 9 | TWD1,040.00 |
| 10 + | TWD957.00 |
* 參考價格
- RS庫存編號:
- 644-469
- 製造零件編號:
- UDM6-40-4-01.5-L-A-TH-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Series | UDM6 | |
| Product Type | PCB Header | |
| Pitch | 0.635mm | |
| Current | 15A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 240 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Row Pitch | 0.635mm | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 1.5mm | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI-SIG | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Series UDM6 | ||
Product Type PCB Header | ||
Pitch 0.635mm | ||
Current 15A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 240 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Row Pitch 0.635mm | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 1.5mm | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI-SIG | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
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