Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 0.635 mm Pitch, 4 Row, Shrouded
- RS庫存編號:
- 202-7907
- 製造零件編號:
- ADM6-60-01.5-L-4-2-A
- 製造商:
- Samtec
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- RS庫存編號:
- 202-7907
- 製造零件編號:
- ADM6-60-01.5-L-4-2-A
- 製造商:
- Samtec
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Series | ADM6 | |
| Product Type | PCB Header | |
| Current | 1.4 | |
| Pitch | 0.635mm | |
| Number of Contacts | 60 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 155V ac | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Series ADM6 | ||
Product Type PCB Header | ||
Current 1.4 | ||
Pitch 0.635mm | ||
Number of Contacts 60 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 155V ac | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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