Samtec ADM6 Series Straight Surface PCB Header, 120 Contact(s), 0.64 mm Pitch, 24 Row, Shrouded
- RS庫存編號:
- 250-2798
- 製造零件編號:
- ADM6-30-01.5-L-4-2-A-TR-1
- 製造商:
- Samtec
此圖片僅供參考，請參閲產品詳細資訊及規格
小計（1 卷，共 700 件）*
TWD341,880.00
(不含稅)
TWD358,974.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月19日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 700 + | TWD488.40 | TWD341,880.00 |
* 參考價格
- RS庫存編號:
- 250-2798
- 製造零件編號:
- ADM6-30-01.5-L-4-2-A-TR-1
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Header | |
| Series | ADM6 | |
| Current | 1.34A | |
| Pitch | 0.64mm | |
| Number of Contacts | 120 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 24 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Material | Copper | |
| Contact Plating | Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -20°C | |
| Row Pitch | 0.635mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS, UL | |
| Mating Pin Length | 2mm | |
| Voltage | 155 V ac, 219 V dc | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Header | ||
Series ADM6 | ||
Current 1.34A | ||
Pitch 0.64mm | ||
Number of Contacts 120 | ||
Housing Material Thermoplastic | ||
Number of Rows 24 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Material Copper | ||
Contact Plating Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature -20°C | ||
Row Pitch 0.635mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS, UL | ||
Mating Pin Length 2mm | ||
Voltage 155 V ac, 219 V dc | ||
豁免
The samtec Accelerate HD High-Density 4-Row Socket has (0.635 mm) .025" Pitch. It has Open-pin-field for grounding and routing flexibility.
It has Slim 5 mm width body design
Edge Rate contact system optimized for signal integrity performance Solder ball technology for simplified processing and self aligning
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