Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 2 Row, Shrouded

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TWD536.00

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TWD562.80

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RS庫存編號:
644-466
製造零件編號:
UDF6-10-2-03.5-L-A-TH-TR
製造商:
Samtec
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品牌

Samtec

Product Type

PCB Header

Series

UDF6

Current

15A

Pitch

0.635mm

Number of Contacts

240

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold, Tin

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Termination Type

Solder

Row Pitch

0.635mm

Tail Pin Length

3.5mm

Maximum Operating Temperature

125°C

Standards/Approvals

PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG

Voltage

283 V

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

PCIe 6.0/CXL 3.1 capable

Weld tabs included for a secure connection to the board

Polarized guide posts for blind mating

Optional alignment pins

0.635 mm signal pitch

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