Samtec ADF6 Series Vertical Surface PCB Socket, 20-Contact, 4 Row, 0.635 mm Pitch Solder
- RS庫存編號:
- 202-7887
- 製造零件編號:
- ADF6-20-03.5-L-4-2-A
- 製造商:
- Samtec
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TWD787.00
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|---|---|
| 1 - 24 | TWD787.00 |
| 25 - 49 | TWD768.00 |
| 50 + | TWD755.00 |
* 參考價格
- RS庫存編號:
- 202-7887
- 製造零件編號:
- ADF6-20-03.5-L-4-2-A
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 20 | |
| Sub Type | High Density Socket | |
| Number of Rows | 4 | |
| Current | 1.34A | |
| Pitch | 0.635mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 5mm | |
| Voltage | 219V | |
| Series | ADF6 | |
| Row Pitch | 0.96mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Tin over Nickel, Gold | |
| Contact Material | Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 20 | ||
Sub Type High Density Socket | ||
Number of Rows 4 | ||
Current 1.34A | ||
Pitch 0.635mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 5mm | ||
Voltage 219V | ||
Series ADF6 | ||
Row Pitch 0.96mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Tin over Nickel, Gold | ||
Contact Material Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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