Samtec ADF6 Series Vertical Surface PCB Socket, 40-Contact, 4 Row, 0.635 mm Pitch Solder
- RS庫存編號:
- 202-7891
- 製造零件編號:
- ADF6-40-03.5-L-4-2-A
- 製造商:
- Samtec
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 件）*
TWD1,156.00
(不含稅)
TWD1,213.80
(含稅)
訂單超過 $1,300.00 免費送貨
最後的 RS 庫存
- 最終 40 個，準備發貨
單位 | 每單位 |
|---|---|
| 1 - 24 | TWD1,156.00 |
| 25 - 49 | TWD1,128.00 |
| 50 + | TWD1,109.00 |
* 參考價格
- RS庫存編號:
- 202-7891
- 製造零件編號:
- ADF6-40-03.5-L-4-2-A
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Number of Contacts | 40 | |
| Product Type | PCB Socket | |
| Number of Rows | 4 | |
| Sub Type | High Density Socket | |
| Current | 1.34A | |
| Pitch | 0.635mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 5mm | |
| Voltage | 219 V | |
| Series | ADF6 | |
| Row Pitch | 0.96mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Tin over Nickel, Gold | |
| Contact Material | Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Number of Contacts 40 | ||
Product Type PCB Socket | ||
Number of Rows 4 | ||
Sub Type High Density Socket | ||
Current 1.34A | ||
Pitch 0.635mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 5mm | ||
Voltage 219 V | ||
Series ADF6 | ||
Row Pitch 0.96mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Tin over Nickel, Gold | ||
Contact Material Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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