Vishay Single IRF620S 1 Type N-Channel Power MOSFET, 5.2 A, 200 V, 3-Pin TO-263 IRF620SPBF

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RS庫存編號:
180-8843
Distrelec 貨號:
304-30-843
製造零件編號:
IRF620SPBF
製造商:
Vishay
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品牌

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

5.2A

Maximum Drain Source Voltage Vds

200V

Package Type

TO-263

Series

IRF620S

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

0.8Ω

Maximum Gate Source Voltage Vgs

20V

Maximum Power Dissipation Pd

50W

Typical Gate Charge Qg @ Vgs

14nC

Minimum Operating Temperature

-55°C

Transistor Configuration

Single

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS 2002/95/EC, IEC 61249-2-21

Number of Elements per Chip

1

Automotive Standard

No

COO (Country of Origin):
CN

Vishay IRF620S Series Power MOSFET, 200V Drain Source Voltage, 50W Maximum Power Dissipation - IRF620SPBF


This power MOSFET is a surface-mounted N-channel transistor designed for high-voltage switching and power applications. It is supplied in a TO-263 package and offers a single-transistor configuration for compact board-level solutions. The component is suitable where controlled switching and thermal resilience are required in industrial and electronic supply designs.

Features and Benefits:


• 200V drain voltage enables high-voltage switching capability
• 5.2A continuous drain current supports moderate load currents
• 50W power dissipation allows sustained power handling
• 0.8Ω drain-source resistance reduces conduction losses
• 14nC typical gate charge improves switching efficiency
• Operates from -55°C to 150°C for wide thermal range

Applications


• Suitable for 200V switching power supplies on PCBs
• Ideal for motor-drive gate switching in control circuits
• Used with PWM controllers in power-conversion designs
• Can be used for general-purpose high-voltage switching tasks
• Used in board-mounted power stage assemblies

What mounting style does it require on a PCB?


It is a surface-mount device supplied in a TO-263 package requiring appropriate soldering pads and a thermal land for heat transfer.

What gate voltage limitations must designers observe?


The gate-source rating is limited to 20V maximum and designs should prevent exceeding this during drive or transients.

How many transistor elements are present on the die?


The component contains a single element per chip, simplifying parallel/series arrangements.

Are there environmental or material standards associated with the device?


It complies with RoHS 2002/95/EC and follows IEC 61249-2-21 material guidelines for manufacturing.

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