Infineon IPT015N10N5 Type N-Channel MOSFET, 300 A, 100 V Enhancement, 9-Pin HSOF

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  • 2026年11月30日 發貨
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RS庫存編號:
170-2320
製造零件編號:
IPT015N10N5ATMA1
製造商:
Infineon
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品牌

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

300A

Maximum Drain Source Voltage Vds

100V

Package Type

HSOF

Series

IPT015N10N5

Mount Type

Surface

Pin Count

9

Maximum Drain Source Resistance Rds

2mΩ

Channel Mode

Enhancement

Forward Voltage Vf

0.9V

Typical Gate Charge Qg @ Vgs

169nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

375W

Maximum Operating Temperature

175°C

Height

2.4mm

Standards/Approvals

No

Length

10.1mm

Automotive Standard

No

Infineon IPT015N10N5 Series MOSFET, 100V Maximum Drain Source Voltage, 300A Maximum Continuous Drain Current - IPT015N10N5ATMA1


This MOSFET is a high-current N-channel switching device designed for power conversion and motor control in demanding electronic systems. It operates over a broad temperature span and is intended for surface-mounted assemblies where robust conduction and rapid switching are required. The component suits designers seeking a compact, high-power transistor for applications requiring significant drain currents and elevated voltage handling.

Features and Benefits:


• 100V drain voltage enables higher-voltage switching applications
• 300A continuous drain current supports heavy-current loads
• 2 mΩ Rds(on) minimises conduction losses under load
• 169 nC typical gate charge reduces switching energy trade-offs
• 375W maximum power dissipation allows high-power operation
• 20V gate tolerance permits flexible gate-drive voltages

Applications


• Suitable for high-current motor drive stages
• Ideal for synchronous rectification in power supplies
• Used with inverter modules for industrial drives
• Can be used for DC-DC converters in power systems
• Appropriate for traction or propulsion power electronics

What thermal range can I expect for harsh environments?


It is specified to function from -55 °C up to 175 °C, accommodating elevated junction conditions.

Which mounting method is required for PCB integration?


The device is intended for surface mounting in an HSOF package footprint for automated assembly.

How many pins are available for connection and layout planning?


The package provides nine pins, allowing for robust current paths and gate/drain/source arrangements.

What channel mode and type does it use for switching topology?


The device is an N-channel MOSFET operating in enhancement mode suitable for low-side or high-side arrangements with appropriate gate driving.

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