Vishay SIRS4300DP Type N-Channel Single MOSFETs, 680 A, 30 V Enhancement, 8-Pin PowerPAK

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RS庫存編號:
653-096
製造零件編號:
SIRS4300DP-T1-RE3
製造商:
Vishay
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品牌

Vishay

Product Type

Single MOSFETs

Channel Type

Type N

Maximum Continuous Drain Current Id

680A

Maximum Drain Source Voltage Vds

30V

Series

SIRS4300DP

Package Type

PowerPAK

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.00040Ω

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

278W

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.1V

Typical Gate Charge Qg @ Vgs

84nC

Maximum Operating Temperature

150°C

Length

6.10mm

Width

5.10mm

Standards/Approvals

RoHS

Height

0.95mm

Automotive Standard

No

COO (Country of Origin):
CN

Vishay SIRS4300DP Series Single MOSFETs, 30V Maximum Drain Source Voltage, 680A Maximum Continuous Drain Current - SIRS4300DP-T1-RE3


This single MOSFETs device is an N-channel enhancement semiconductor intended for high-current switching and power-conversion roles in industrial electronics. It is supplied in an 8-pin surface-mount PowerPAK package and is suited to demanding thermal and electrical environments where compact, low-loss switching is required.

Features and Benefits:


• 30V drain rating enables low-voltage power-stage designs • 680A continuous drain current supports heavy load switching • 0.00040Ω Rds(on) reduces conduction losses for efficiency • 84nC typical gate charge allows Faster gate transitions • 278W power dissipation manages high energy throughput • Operates to 150°C for elevated temperature applications

Applications


• Suitable for high-current DC-DC converters in automation systems • Ideal for power stages in motor drive controllers • Used for synchronous rectification in power-supply modules • Can be used for load switching in industrial power distribution • Used with parallel arrays for data-centre power racks

What gate-drive margin is acceptable for reliable switching?


The device tolerates gate voltages up to 20V

design gate drivers to operate within this limit and to achieve the typical 84nC charge for intended switching speeds.

How should thermal management be approached on a PCB?


Given the 278W dissipation capability, use large copper areas, thermal vias and direct heatsinking to the PowerPAK exposed pad to keep junction temperatures within limits.

Can it be paralleled to increase current capacity?


Paralleling is feasible provided matching Rds(on) and proper current-sharing measures are implemented, along with careful gate-drive timing to avoid imbalance.

What environmental temperature range can it tolerate during service?


The component is specified for operation down to -55°C and up to 150°C for junction or case conditions as defined in system thermal design.

What package considerations affect layout density?


The 8-pin PowerPAK surface-mount format permits Compact placement but requires attention to copper heatsinking and trace width for high-current paths.

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