Infineon IGBT Module 650 V, Through Hole
- RS庫存編號:
- 248-1199
- 製造零件編號:
- F3L100R07W2H3B11BPSA1
- 製造商:
- Infineon
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可享批量折扣
查看批量定價選項小計（1 托盤，共 15 件）*
TWD24,435.00
(不含稅)
TWD25,656.75
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年8月31日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 15 - 15 | TWD1,629.00 | TWD24,435.00 |
| 30 + | TWD1,596.40 | TWD23,946.00 |
* 參考價格
- RS庫存編號:
- 248-1199
- 製造零件編號:
- F3L100R07W2H3B11BPSA1
- 製造商:
- Infineon
規格
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法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Product Type | IGBT Module | |
| Maximum Collector Emitter Voltage Vceo | 650V | |
| Maximum Power Dissipation Pd | 20mW | |
| Number of Transistors | 4 | |
| Mount Type | Through Hole | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 150°C | |
| Length | 56.7mm | |
| Height | 12mm | |
| Standards/Approvals | RoHS | |
| Series | F3L100R07W2H3B11 | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Product Type IGBT Module | ||
Maximum Collector Emitter Voltage Vceo 650V | ||
Maximum Power Dissipation Pd 20mW | ||
Number of Transistors 4 | ||
Mount Type Through Hole | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2V | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 150°C | ||
Length 56.7mm | ||
Height 12mm | ||
Standards/Approvals RoHS | ||
Series F3L100R07W2H3B11 | ||
Automotive Standard No | ||
The Infineon makes this EasyPACK 2B 650 V, 100 A 3-level IGBT module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC. This device offers easy of use compact design, optimized performance. The device provides added benefits like increased blocking voltage capability up to 650 V, low inductive design, low switching losses and low VCE,sat. It uses an Al2O3 substrate with low thermal resistance and PressFIT contact technology. This device offers rugged mounting due to integrated mounting clamp.
Best cost-performance ratio with reduced system costs
High degree of freedom in design, and uses IGBT HighSpeed 3 technology
Highest efficiency and power density
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