Winbond SLC NAND 2 GB Parallel Flash Memory 63-Pin VFBGA, W29N02GZBIBA

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TWD436.80

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包裝方式:
RS庫存編號:
188-2874
製造零件編號:
W29N02GZBIBA
製造商:
Winbond
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品牌

Winbond

Memory Size

2GB

Product Type

Flash Memory

Interface Type

Parallel

Package Type

VFBGA

Pin Count

63

Organisation

256M x 8 Bit

Mount Type

Surface

Cell Type

SLC NAND

Minimum Supply Voltage

1.7V

Maximum Supply Voltage

1.95V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Height

0.6mm

Width

11.1 mm

Standards/Approvals

No

Length

11.1mm

Series

W29N02GZ

Automotive Standard

No

Number of Words

256M

Maximum Random Access Time

25μs

Number of Bits per Word

8

Supply Current

20mA

Density : 2Gbit (Single chip solution)

Vcc : 1.7V to 1.95V

Bus width : x8 x16

Operating temperature

Industrial: -40°C to 85°C

Industrial Plus: -40°C to 105°C

Single-Level Cell (SLC) technology.

Organization

Density: 2G-bit/256M-byte

Page size

2,112 bytes (2048 + 64 bytes)

1,056 words (1024 + 32 words)

Block size

64 pages (128K + 4K bytes)

64 pages (64K + 2K words)

Highest Performance

Read performance (Max.)

Random read: 25us

Sequential read cycle: 25ns

Write Erase performance

Page program time: 250us(typ.)

Block erase time: 2ms(typ.)

Endurance 100,000 Erase/Program Cycles(1)

10-years data retention

Command set

Standard NAND command

Additional command suppo

Copy Back

Two-plane operation

Contact Winbond for OTP f

Contact Winbond for Block

Lowest power consumption

Read: 13mA(typ.)

Program/Erase: 10mA(typ.)

CMOS standby: 10uA(typ.)

Space Efficient Packaging

48-pin standard TSOP1

63-ball VFBGA

2Gb SLC NAND Flash Memory with uniform 2KB+64B page size.

Bus Width: x8

Random Read: 25us

Page Program Time: 250us(typ.)

Block Erase Time: 2ms(typ.)

Support OTP Memory Area

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