Winbond SLC NAND 8 GB Parallel Flash Memory 63-Pin VFBGA, W29N08GZBIBA

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包裝方式:
RS庫存編號:
188-2657
製造零件編號:
W29N08GZBIBA
製造商:
Winbond
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品牌

Winbond

Product Type

Flash Memory

Memory Size

8GB

Interface Type

Parallel

Package Type

VFBGA

Pin Count

63

Maximum Clock Frequency

40MHz

Mount Type

Surface

Cell Type

SLC NAND

Maximum Supply Voltage

1.95V

Minimum Supply Voltage

1.7V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Height

0.6mm

Standards/Approvals

No

Length

11.1mm

Number of Bits per Word

8

Series

W29N08GZ

Number of Words

1024K

Maximum Random Access Time

25μs

Automotive Standard

No

Density : 8Gbit (2 chip stacked solution)

Vcc : 1.7V to 1.95V

Bus width : x8/x16

Operating temperature

Industrial: -40°C to 85°C

Single-Level Cell (SLC) technology.

Organization

Density: 8G-bit/1G-byte

Page size

2,112 bytes (2048 + 64 bytes)

1,056 words (1024 + 32 words)

Block size

64 pages (128K + 4K bytes)

64 pages (64K + 2K words)

Highest Performance

Read performance (Max.)

Random read: 25us

Sequential read cycle: 35ns

Write Erase performance

Page program time: 250us(typ.)

Block erase time: 2ms(typ.)

Endurance 100,000 Erase/Program Cycles(1)

10-years data retention

Command set

Standard NAND command set

Additional command support

Copy Back

Two-plane operation

Contact Winbond for OTP feature

Contact Winbond for Block Lock feature

Lowest power consumption

Read: 13mA(typ.)

Program/Erase: 13mA(typ.)

CMOS standby: 20uA(typ.)

Space Efficient Packaging

48-pin standard TSOP1

63-ball VFBGA

8Gb SLC NAND Flash Memory with uniform 2KB+64B page size.

Bus Width: x8

Random Read: 25us

Page Program Time: 250us(typ.)

Block Erase Time: 2ms(typ.)

Support OTP Memory Area

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