Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder

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RS庫存編號:
227-1081
製造零件編號:
CLP-130-02-L-D-P-TR
製造商:
Samtec
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品牌

Samtec

Number of Contacts

60

Product Type

PCB Socket

Sub Type

Dual Wipe Socket

Number of Rows

2

Current

3.4A

Pitch

1.27mm

Termination Type

Solder

Housing Material

Liquid Crystal Polymer

Mount Type

Surface

Orientation

Horizontal

Connector System

Board-to-Board

Voltage

395 V

Series

CLP

Minimum Operating Temperature

-55°C

Row Pitch

1.27mm

Contact Plating

Gold

Contact Material

Phosphor Bronze

Maximum Operating Temperature

125°C

Standards/Approvals

No

The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.

Dual row

Pick & place pad

Alignment Pin

Tape and reel packaging

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