Samtec CLP Series Horizontal Surface PCB Socket, 24-Contact, 2 Row, 1.27 mm Pitch Solder
- RS庫存編號:
- 227-1070
- 製造零件編號:
- CLP-112-02-L-D-A-P-TR
- 製造商:
- Samtec
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計（1 卷，共 1050 件）*
TWD131,565.00
(不含稅)
TWD138,138.00
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每卷* |
|---|---|---|
| 1050 - 4200 | TWD125.30 | TWD131,565.00 |
| 5250 + | TWD121.60 | TWD127,680.00 |
* 參考價格
- RS庫存編號:
- 227-1070
- 製造零件編號:
- CLP-112-02-L-D-A-P-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Number of Contacts | 24 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Number of Contacts 24 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 12 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
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