Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder

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RS庫存編號:
227-1079
製造零件編號:
CLP-130-02-L-D-P-TR
製造商:
Samtec
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品牌

Samtec

Product Type

PCB Socket

Number of Contacts

60

Number of Rows

2

Sub Type

Dual Wipe Socket

Current

3.4A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Termination Type

Solder

Mount Type

Surface

Orientation

Horizontal

Connector System

Board-to-Board

Voltage

395 V

Series

CLP

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Contact Material

Phosphor Bronze

Maximum Operating Temperature

125°C

Contact Plating

Gold

Standards/Approvals

No

The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.

Dual row

Pick & place pad

Alignment Pin

Tape and reel packaging

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