Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder
- RS庫存編號:
- 227-1079
- 製造零件編號:
- CLP-130-02-L-D-P-TR
- 製造商:
- Samtec
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- RS庫存編號:
- 227-1079
- 製造零件編號:
- CLP-130-02-L-D-P-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 60 | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 60 | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
相關連結
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- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
