Samtec ADF6 Series Vertical Surface PCB Socket, 50-Contact, 4 Row, 0.635 mm Pitch Solder
- RS庫存編號:
- 202-7892
- 製造零件編號:
- ADF6-50-03.5-L-4-2-A
- 製造商:
- Samtec
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- RS庫存編號:
- 202-7892
- 製造零件編號:
- ADF6-50-03.5-L-4-2-A
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Sub Type | High Density Socket | |
| Number of Rows | 4 | |
| Pitch | 0.635mm | |
| Current | 1.34A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Stacking Height | 5mm | |
| Connector System | Board-to-Board | |
| Voltage | 219 V | |
| Series | ADF6 | |
| Row Pitch | 0.96mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold, Tin over Nickel | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | CHINA RoHS, EU REACH, EU RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Sub Type High Density Socket | ||
Number of Rows 4 | ||
Pitch 0.635mm | ||
Current 1.34A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Stacking Height 5mm | ||
Connector System Board-to-Board | ||
Voltage 219 V | ||
Series ADF6 | ||
Row Pitch 0.96mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Copper Alloy | ||
Contact Plating Gold, Tin over Nickel | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals CHINA RoHS, EU REACH, EU RoHS | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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