Infineon HEXFET Type P-Channel MOSFET, 3 A, 30 V Enhancement, 3-Pin SOT-23

此圖片僅供參考,請參閲產品詳細資訊及規格

可享批量折扣

小計(1 卷,共 3000 件)*

TWD9,000.00

(不含稅)

TWD9,450.00

(含稅)

Add to Basket
選擇或輸入數量
有庫存
  • 27,000 件準備從其他地點送貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位
每單位
每卷*
3000 - 12000TWD3.00TWD9,000.00
15000 +TWD2.90TWD8,700.00

* 參考價格

RS庫存編號:
913-4705
製造零件編號:
IRLML5203TRPBF
製造商:
Infineon
透過選取一個或多個屬性來查找類似產品。
選取全部

品牌

Infineon

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

3A

Maximum Drain Source Voltage Vds

30V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

165mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

9.5nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

1.25W

Maximum Gate Source Voltage Vgs

20 V

Forward Voltage Vf

-1.2V

Maximum Operating Temperature

150°C

Width

1.4 mm

Height

1.02mm

Length

3.04mm

Standards/Approvals

No

Automotive Standard

No

COO (Country of Origin):
MX

Infineon HEXFET Series MOSFET, 3A Maximum Continuous Drain Current, 30V Maximum Drain Source Voltage - IRLML5203TRPBF


This MOSFET is a high-performance power device suitable for a range of applications in the electronics sector. Featuring a compact SOT-23 package, this P-channel device provides significant efficiency with a maximum continuous drain current of 3A and a drain-source voltage of 30V. With dimensions of 3.04mm in length, 1.4mm in width, and 1.02mm in height, it is well-suited for space-constrained designs.

Features & Benefits


• Capable of 30V drain-source voltage for versatile use

• Designed for surface mount for simplified PCB design

• Operates within a temperature range of -55°C to +150°C

• Utilises enhancement mode for reliable switching performance

Applications


• Utilised in battery management systems for optimal performance

• Used in portable electronics due to low-profile design

• Applied in load management solutions across various devices

• Suitable for advanced automation control systems

What is the significance of the low Rds(on) in this device?


The low Rds(on) ensures reduced power loss during operation, which enhances overall efficiency and maintains lower thermal levels in applications.

How does the power dissipation capability impact device performance?


The capability to dissipate up to 1.25W allows for effective heat management, ensuring the device operates reliably even under maximum load conditions without thermal failure.

What factors influence the selection of this MOSFET for a specific application?


Factors such as maximum continuous drain current, voltage ratings, and thermal characteristics should be considered to ensure compatibility with circuit requirements and performance expectations.

相關連結