Infineon SIPMOS Type N-Channel MOSFET, 350 mA, 240 V Depletion, 4-Pin SOT-223 BSP129H6327XTSA1
- RS庫存編號:
- 753-2800
- 製造零件編號:
- BSP129H6327XTSA1
- 製造商:
- Infineon
此圖片僅供參考,請參閲產品詳細資訊及規格
小計(1 包,共 5 件)*
TWD175.00
(不含稅)
TWD183.75
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 5 件從 2026年8月14日 起裝運發貨
- 加上 1,000 件從 2026年10月01日 起發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 5 + | TWD35.00 | TWD175.00 |
* 參考價格
- RS庫存編號:
- 753-2800
- 製造零件編號:
- BSP129H6327XTSA1
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 350mA | |
| Maximum Drain Source Voltage Vds | 240V | |
| Series | SIPMOS | |
| Package Type | SOT-223 | |
| Mount Type | Surface | |
| Pin Count | 4 | |
| Maximum Drain Source Resistance Rds | 20Ω | |
| Channel Mode | Depletion | |
| Maximum Power Dissipation Pd | 1.8W | |
| Typical Gate Charge Qg @ Vgs | 3.8nC | |
| Forward Voltage Vf | 1.2V | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 150°C | |
| Length | 6.5mm | |
| Standards/Approvals | No | |
| Height | 1.6mm | |
| Automotive Standard | AEC-Q101 | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 350mA | ||
Maximum Drain Source Voltage Vds 240V | ||
Series SIPMOS | ||
Package Type SOT-223 | ||
Mount Type Surface | ||
Pin Count 4 | ||
Maximum Drain Source Resistance Rds 20Ω | ||
Channel Mode Depletion | ||
Maximum Power Dissipation Pd 1.8W | ||
Typical Gate Charge Qg @ Vgs 3.8nC | ||
Forward Voltage Vf 1.2V | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 150°C | ||
Length 6.5mm | ||
Standards/Approvals No | ||
Height 1.6mm | ||
Automotive Standard AEC-Q101 | ||
Infineon SIPMOS Series MOSFET, 240V Maximum Drain Source Voltage, 350mA Maximum Continuous Drain Current - BSP129H6327XTSA1
This MOSFET is a high-voltage N-channel device designed for surface-mount power switching in demanding electronic systems. It operates across an extended ambient range and is suited to applications that require controlled conduction at elevated voltages while remaining compatible with SOT-223 mounting and automotive-grade expectations.
Features and Benefits:
• 240V drain rating enables high-voltage switching applications
• 350mA continuous drain current supports low-power loads
• 20Ω maximum Rds provides predictable on-state behaviour
• 3.8nC typical gate charge facilitates efficient switching
• 1.8W power dissipation allows moderate thermal loading
• 1.2V forward voltage ensures low voltage drop in conduction
• 350mA continuous drain current supports low-power loads
• 20Ω maximum Rds provides predictable on-state behaviour
• 3.8nC typical gate charge facilitates efficient switching
• 1.8W power dissipation allows moderate thermal loading
• 1.2V forward voltage ensures low voltage drop in conduction
Applications
• Used for high-voltage signal switching in automotive subsystems
• Suitable for low-current power rails and control circuitry
• Ideal for board-level power conditioning modules
• Used with thermal management on compact surface assemblies
• Can be used for battery-management peripheral functions
• Suitable for low-current power rails and control circuitry
• Ideal for board-level power conditioning modules
• Used with thermal management on compact surface assemblies
• Can be used for battery-management peripheral functions
What gate drive constraints should I consider for switching?
The device accepts up to 20V between gate and source
design gate drivers to respect this limit and to provide adequate slew for the 3.8nC gate charge to balance switching speed and EMI.
How does temperature affect its electrical limits?
The component is specified to operate from -55°C to 150°C
designers must account for derating of power dissipation and junction-to-ambient thermal resistance when operating near the upper temperature bound.
What mounting considerations apply for thermal control?
The SOT-223 package is surface-mounted and benefits from PCB copper area for heat spreading
use a thermal pad or additional copper to maintain junction temperature under the 1.8W dissipation.
Are there specific pin-count constraints for layout?
The device presents four pins
ensure correct pad pattern and trace widths to handle the continuous drain current and to minimise parasitic resistance.
相關連結
- Infineon SIPMOS Type N-Channel MOSFET 240 V Enhancement, 4-Pin SOT-223 BSP89H6327XTSA1
- Infineon SIPMOS Type N-Channel MOSFET 600 V Depletion, 4-Pin SOT-223
- Infineon SIPMOS Type N-Channel MOSFET 200 V Depletion, 4-Pin SOT-223
- Infineon SIPMOS Type N-Channel MOSFET 200 V Depletion, 4-Pin SOT-223 BSP149H6327XTSA1
- Infineon SIPMOS Type N-Channel MOSFET 600 V Depletion, 4-Pin SOT-223 BSP135H6327XTSA1
- Infineon SIPMOS N-Channel MOSFET 250 V Depletion, 3-Pin SOT-23 BSS139H6327XTSA1
- Infineon SIPMOS Type N-Channel MOSFET 600 V Depletion, 3-Pin SOT-23
- Infineon SIPMOS Type N-Channel MOSFET 600 V Depletion, 3-Pin SOT-23 BSS126H6327XTSA2
