Infineon OptiMOS N-Channel MOSFET, 60 A, 100 V Enhancement, 3-Pin TO-252 IPD60N10S4L12ATMA1

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TWD56,950.00

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RS庫存編號:
222-4667
製造零件編號:
IPD60N10S4L12ATMA1
製造商:
Infineon
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品牌

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

60A

Maximum Drain Source Voltage Vds

100V

Package Type

TO-252

Series

OptiMOS

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

12mΩ

Channel Mode

Enhancement

Forward Voltage Vf

1.3V

Maximum Gate Source Voltage Vgs

16V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

94W

Typical Gate Charge Qg @ Vgs

38nC

Maximum Operating Temperature

175°C

Width

6.22mm

Height

2.3mm

Standards/Approvals

No

Length

6.5mm

Automotive Standard

AEC-Q101

Infineon OptiMOS Series MOSFET, 100V Maximum Drain Source Voltage, 60A Maximum Continuous Drain Current - IPD60N10S4L12ATMA1


This MOSFET is a high-voltage N-channel switch designed for demanding electronic power stages and automotive environments. It operates over a wide temperature range and is intended for surface-mount assemblies requiring robust switching performance and thermal handling.

Features and Benefits:


• 100 V drain rating enabling high-voltage switching capability
• 60 A continuous drain current supporting heavy current loads
• 12 mΩ Rds(on) reducing conduction losses in power paths
• 94 W power dissipation improving thermal endurance under load
• 38 nC typical gate charge allowing predictable switching energy
• 16 V maximum gate drive permitting flexible gate-voltage choices

Applications


• Suitable for automotive power converters requiring AEC‑Q101 compliance
• Ideal for DC-DC converters in transport and industrial systems
• Used for motor-drive half-bridge stages in EV subsystems
• Can be used for synchronous rectification in power supplies
• Used with Compact surface-mount assemblies on thermal PCBs

What temperature extremes can it withstand in operation?


It is specified to operate from −55 °C up to 175 °C, allowing use in high-temperature environments.

What packaging and mounting considerations apply for thermal management?


It is supplied in a TO‑252 surface-mount package that facilitates board-mounted heat dissipation and standard solder reflow attachment.

What gate-voltage limits should be observed to avoid device stress?


The maximum gate-to-source voltage is 16 V and gate-drive circuitry should not exceed this to prevent gate damage.

What channel conduction mode and type does it employ?


It uses an enhancement-mode N-channel configuration suitable for low-side and high-side switching when gate drive is appropriate.

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