Infineon SIPMOS Type N-Channel MOSFET, 230 mA, 60 V Enhancement, 3-Pin SOT-23 BSS138NH6433XTMA1

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RS庫存編號:
178-7507
Distrelec 貨號:
304-24-004
製造零件編號:
BSS138NH6433XTMA1
製造商:
Infineon
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品牌

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

230mA

Maximum Drain Source Voltage Vds

60V

Package Type

SOT-23

Series

SIPMOS

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

3.5Ω

Channel Mode

Enhancement

Maximum Power Dissipation Pd

360mW

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

1nC

Forward Voltage Vf

0.83V

Maximum Operating Temperature

150°C

Length

2.9mm

Height

1mm

Standards/Approvals

No

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 60V Maximum Drain Source Voltage, 3.5Ω Maximum Drain Source Resistance - BSS138NH6433XTMA1


This MOSFET is a compact N-channel transistor designed for low-current switching in surface-mount applications. It operates across a wide temperature range, making it suitable for environments that demand extended thermal tolerance. The device is built for use where controlled enhancement-mode switching and modest power handling are required.

Features and Benefits:


• 60V drain voltage enables use in intermediate-voltage systems
• 3.5Ω low Rds(on) reduces conduction losses in small-signal circuits
• 230mA continuous drain current supports low-power switching loads
• 1nC typical gate charge allows fast gate transitions with minimal drive energy
• 360mW power dissipation helps manage thermal loading in constrained designs
• 20V maximum gate rating protects against excessive drive voltages

Applications


• Suitable for automotive sensor signal switching
• Ideal for handheld instrument power management
• Used with control logic in telematics modules
• Can be used for load switching in battery-operated devices
• Suitable for general-purpose small-signal switching on PCBs

What mounting style is required for this component?


It uses a SOT-23 package intended for surface-mount placement on printed circuit assemblies.

How does it cope with elevated operating temperatures?


The device is specified to function from -55°C up to 150°C, permitting use in high-temperature environments with appropriate thermal design.

What gate drive considerations should be observed?


Keep gate voltage within ±20V to avoid overstressing the gate oxide and ensure gate-drive circuits supply sufficient current for the 1nC typical gate charge.

Is this device suitable for high-current power stages?


It is intended for small-signal and low-current switching

the 230mA continuous drain current and 3.5Ω Rds(on) limit its suitability for high-current power stages.

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