Vishay Siliconix SQJ872EP Type N-Channel MOSFET, 24.5 A, 150 V Enhancement, 8-Pin SO-8L SQJ872EP-T1_GE3

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RS庫存編號:
178-3721
製造零件編號:
SQJ872EP-T1_GE3
製造商:
Vishay Siliconix
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品牌

Vishay Siliconix

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

24.5A

Maximum Drain Source Voltage Vds

150V

Package Type

SO-8L

Series

SQJ872EP

Mount Type

PCB

Pin Count

8

Maximum Drain Source Resistance Rds

0.0395Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

14nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

55W

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

175°C

Width

5mm

Standards/Approvals

RoHS

Length

5.99mm

Height

1.07mm

Automotive Standard

AEC-Q101

豁免

COO (Country of Origin):
CN

Vishay SQJ872EP Series MOSFET, 150V Drain Source Voltage, 24.5A Continuous Drain Current - SQJ872EP-T1_GE3


This MOSFET is a power switching device designed for high-voltage, high-current applications in demanding environments. It functions as an N‑channel enhancement transistor for switching and power conversion roles. The device is suitable for PCB mounting in a small-outline package and is manufactured to meet industry environmental standards.

Features and Benefits:


• Low on-resistance 0.0395Ω delivering reduced conduction losses
• High voltage capability 150V enabling robust switching headroom
• Continuous current rating 24.5A supporting substantial load currents
• Gate charge 14nC enabling efficient switching control
• Power dissipation 55W allowing sustained thermal load handling
• Wide gate tolerance ±20V making gate drive design flexible

Applications


• Suitable for automotive power stages requiring AEC‑Q101 compliance
• Ideal for industrial motor drive switch arrays
• Used with DC-DC converters in high-voltage systems
• Can be used for synchronous rectification in power supplies
• Useful in inverter and UPS front-end switching stages

What temperature range can it tolerate in harsh installations?


It operates across an extended span from -55°C up to 175°C, supporting extreme industrial and automotive thermal conditions.

What package and mounting approach does it use for board assembly?


The device is supplied in an SO‑8L package designed for PCB mounting to simplify integration into compact assemblies.

How does its forward voltage impact system design?


The forward conduction drop is 1.2V under specified conditions, which should be included in power-loss calculations and thermal‑management assessments.

Is the device suitable for regulated manufacturing and environmental requirements?


It meets RoHS directives, indicating restriction of specified hazardous substances in the component materials.

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