Vishay SQ3419CEV Type P-Channel Single MOSFETs, -6.9 A, -40 V Enhancement, 6-Pin TSOP-6
- RS庫存編號:
- 653-162
- 製造零件編號:
- SQ3419CEV-T1_GE3
- 製造商:
- Vishay
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- RS庫存編號:
- 653-162
- 製造零件編號:
- SQ3419CEV-T1_GE3
- 製造商:
- Vishay
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Vishay | |
| Product Type | Single MOSFETs | |
| Channel Type | Type P | |
| Maximum Continuous Drain Current Id | -6.9A | |
| Maximum Drain Source Voltage Vds | -40V | |
| Package Type | TSOP-6 | |
| Series | SQ3419CEV | |
| Mount Type | PCB | |
| Pin Count | 6 | |
| Maximum Drain Source Resistance Rds | 0.092Ω | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Gate Source Voltage Vgs | 20V | |
| Forward Voltage Vf | -1.2V | |
| Maximum Power Dissipation Pd | 5W | |
| Typical Gate Charge Qg @ Vgs | 11.3nC | |
| Maximum Operating Temperature | 175°C | |
| Height | 1.1mm | |
| Width | 2.98mm | |
| Length | 3.10mm | |
| Standards/Approvals | RoHS | |
| Automotive Standard | AEC-Q101 | |
| 選取全部 | ||
|---|---|---|
品牌 Vishay | ||
Product Type Single MOSFETs | ||
Channel Type Type P | ||
Maximum Continuous Drain Current Id -6.9A | ||
Maximum Drain Source Voltage Vds -40V | ||
Package Type TSOP-6 | ||
Series SQ3419CEV | ||
Mount Type PCB | ||
Pin Count 6 | ||
Maximum Drain Source Resistance Rds 0.092Ω | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Gate Source Voltage Vgs 20V | ||
Forward Voltage Vf -1.2V | ||
Maximum Power Dissipation Pd 5W | ||
Typical Gate Charge Qg @ Vgs 11.3nC | ||
Maximum Operating Temperature 175°C | ||
Height 1.1mm | ||
Width 2.98mm | ||
Length 3.10mm | ||
Standards/Approvals RoHS | ||
Automotive Standard AEC-Q101 | ||
Vishay SQ3419CEV Series Single MOSFETs, 5W Maximum Power Dissipation, -40V Maximum Drain Source Voltage - SQ3419CEV-T1_GE3
This single MOSFETs device is a P‑channel enhancement‑mode power transistor designed for PCB mounting in electronic systems requiring controlled high‑side switching and power management. It operates across a broad temperature range and meets automotive qualification standards, making it suitable for demanding environments where compact packaged MOSFETs are required.
Features and Benefits:
• 40V drain‑source rating enabling robust high‑side switching
• 6.9A continuous drain current supporting moderate load currents
• 0.092Ω maximum Rds(on) reducing conduction losses
• 11.3nC typical gate charge allowing faster gate transitions
• 5W maximum power dissipation handling thermal stress during operation
• AEC‑Q101 qualification providing suitability for automotive electronics
• 6.9A continuous drain current supporting moderate load currents
• 0.092Ω maximum Rds(on) reducing conduction losses
• 11.3nC typical gate charge allowing faster gate transitions
• 5W maximum power dissipation handling thermal stress during operation
• AEC‑Q101 qualification providing suitability for automotive electronics
Applications
• Suitable for high‑side switching in vehicle control modules
• Ideal for power distribution in compact motor drivers
• Used with battery management systems for protection switching
• Can be used for DC‑DC converter P‑channel stages
• Suitable for compact PCB power control in industrial modules
• Ideal for power distribution in compact motor drivers
• Used with battery management systems for protection switching
• Can be used for DC‑DC converter P‑channel stages
• Suitable for compact PCB power control in industrial modules
What package is used and how does it benefit PCB layout?
It uses a TSOP‑6 package which offers a low profile and multiple pins for thermal and electrical connection, simplifying PCB routing in space‑constrained designs.
What gate voltage limits should designers observe?
The gate‑to‑source voltage must not exceed ±20V to avoid gate oxide stress and ensure long‑term reliability.
How does the device perform in high‑temperature environments?
The device is rated to operate from -55°C up to 175°C, allowing use in applications with wide thermal excursions.
What pin count and mounting style are specified?
It has six pins and is intended for PCB mounting to facilitate integration into standard board assemblies.
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