Infineon HybridPACK Drive G2 Type N-Channel MOSFET, 620 A, 750 V Enhancement HybridPACK Drive G2 FS01MR08A8MA2LBCHPSA1
- RS庫存編號:
- 349-030
- 製造零件編號:
- FS01MR08A8MA2LBCHPSA1
- 製造商:
- Infineon
小計(1 件)*
TWD150,170.00
(不含稅)
TWD157,678.50
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年12月10日 發貨
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單位 | 每單位 |
|---|---|
| 1 + | TWD150,170.00 |
* 參考價格
- RS庫存編號:
- 349-030
- 製造零件編號:
- FS01MR08A8MA2LBCHPSA1
- 製造商:
- Infineon
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 620A | |
| Maximum Drain Source Voltage Vds | 750V | |
| Package Type | HybridPACK Drive G2 | |
| Series | HybridPACK Drive G2 | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 2.21mΩ | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 6.73V | |
| Maximum Gate Source Voltage Vgs | 19 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 200°C | |
| Standards/Approvals | Lead-Free, RoHS, UL 94 V0 | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 620A | ||
Maximum Drain Source Voltage Vds 750V | ||
Package Type HybridPACK Drive G2 | ||
Series HybridPACK Drive G2 | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 2.21mΩ | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 6.73V | ||
Maximum Gate Source Voltage Vgs 19 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 200°C | ||
Standards/Approvals Lead-Free, RoHS, UL 94 V0 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 CoolSiC G2 module is a highly compact B6 bridge power module with enhanced package optimized for various inverter power classes. The power module implements the second generation CoolSiC Automotive MOSFET 750V, optimized for electric drive train applications, from mid to high range automotive power classes to high range commercial, construction, and agricultural vehicles.
Compact design
High power density
Direct cooled PinFin base plate
High performance Si3N4 ceramic
PCB and cooler assembly guidelines
Integrated temperature sensing diode
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