Dual N-Channel MOSFET, 53 A, 650 V, 8-Pin ACEPACK SMIT STMicroelectronics SH63N65DM6AG

The STMicroelectronics device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.

AQG 324 qualified
Half-bridge power module
650 V blocking voltage
Fast recovery body diode
Very low switching energies
Low package inductance