Infineon FF1800R12IE5PBPSA1, Type N-Channel Inverter, 1800 A 1200 V, 10-Pin PRIME3, Surface
- RS庫存編號:
- 218-4331
- 製造零件編號:
- FF1800R12IE5PBPSA1
- 製造商:
- Infineon
可享批量折扣
小計（1 件）*
TWD33,988.00
(不含稅)
TWD35,687.40
(含稅)
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單位 | 每單位 |
|---|---|
| 1 - 4 | TWD33,988.00 |
| 5 + | TWD32,968.00 |
* 參考價格
- RS庫存編號:
- 218-4331
- 製造零件編號:
- FF1800R12IE5PBPSA1
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 1800A | |
| Product Type | Inverter | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Number of Transistors | 2 | |
| Package Type | PRIME3 | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Pin Count | 10 | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2.6V | |
| Maximum Operating Temperature | 175°C | |
| Width | 86 mm | |
| Series | FF1800R12IE5P | |
| Length | 247mm | |
| Standards/Approvals | No | |
| Height | 38.25mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 1800A | ||
Product Type Inverter | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Number of Transistors 2 | ||
Package Type PRIME3 | ||
Mount Type Surface | ||
Channel Type Type N | ||
Pin Count 10 | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2.6V | ||
Maximum Operating Temperature 175°C | ||
Width 86 mm | ||
Series FF1800R12IE5P | ||
Length 247mm | ||
Standards/Approvals No | ||
Height 38.25mm | ||
Automotive Standard No | ||
The Infineon PrimePack dual IGBT module with TRENCHSTOP IGBT5 and .XT interconnection technology. It has collector emitter voltage of 1800 V. The N-Channel TRENCHSTOP and field stop IGBT Modules are suitable for hard switching and soft switching applications such as high power converters, UPS system, motor drives and solar applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Less cooling effort for same output power
Enables higher system overload conditions
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