Infineon FF1800R17IP5BPSA1, Type N-Channel IGBT, 1800 A 1700 V AG-PRIME3+, Surface
- RS庫存編號:
- 222-4792
- 製造零件編號:
- FF1800R17IP5BPSA1
- 製造商:
- Infineon
可享批量折扣
小計（1 件）*
TWD32,563.00
(不含稅)
TWD34,191.15
(含稅)
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單位 | 每單位 |
|---|---|
| 1 - 9 | TWD32,563.00 |
| 10 + | TWD31,750.00 |
* 參考價格
- RS庫存編號:
- 222-4792
- 製造零件編號:
- FF1800R17IP5BPSA1
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 1800A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1700V | |
| Number of Transistors | 2 | |
| Maximum Power Dissipation Pd | 1800kW | |
| Package Type | AG-PRIME3+ | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.75V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Series | FF1800R17IP5 | |
| Standards/Approvals | No | |
| Length | 247mm | |
| Height | 38.25mm | |
| Width | 86 mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 1800A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1700V | ||
Number of Transistors 2 | ||
Maximum Power Dissipation Pd 1800kW | ||
Package Type AG-PRIME3+ | ||
Mount Type Surface | ||
Channel Type Type N | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.75V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Series FF1800R17IP5 | ||
Standards/Approvals No | ||
Length 247mm | ||
Height 38.25mm | ||
Width 86 mm | ||
Automotive Standard No | ||
The Infineon PrimePACK™3+ 1700 V, 1800 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT soft switching interconnection technology, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material.
Extended operation temperature (Tvjop= 175°C)
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
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