Infineon FF1200R12IE5PBPSA1, Type N-Channel Inverter, 1200 A 1200 V, 10-Pin PRIME2, Surface
- RS庫存編號:
- 218-4321
- 製造零件編號:
- FF1200R12IE5PBPSA1
- 製造商:
- Infineon
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可享批量折扣
小計（1 件）*
TWD24,753.00
(不含稅)
TWD25,990.65
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 2 件從 2026年7月16日 起裝運發貨
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單位 | 每單位 |
|---|---|
| 1 - 4 | TWD24,753.00 |
| 5 + | TWD24,258.00 |
* 參考價格
- RS庫存編號:
- 218-4321
- 製造零件編號:
- FF1200R12IE5PBPSA1
- 製造商:
- Infineon
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 1200A | |
| Product Type | Inverter | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Number of Transistors | 2 | |
| Package Type | PRIME2 | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Pin Count | 10 | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2.15V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Height | 22mm | |
| Length | 172mm | |
| Standards/Approvals | No | |
| Series | FF1200R12IE5P | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 1200A | ||
Product Type Inverter | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Number of Transistors 2 | ||
Package Type PRIME2 | ||
Mount Type Surface | ||
Channel Type Type N | ||
Pin Count 10 | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2.15V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Height 22mm | ||
Length 172mm | ||
Standards/Approvals No | ||
Series FF1200R12IE5P | ||
Automotive Standard No | ||
The Infineon PrimePack dual IGBT module with TRENCHSTOP IGBT5 and .XT interconnection technology. It has collector emitter voltage of 1200 V. The N-Channel TRENCHSTOP and field stop IGBT Modules are suitable for hard switching and soft switching applications such as high power converters, UPS system, motor drives and solar applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Less cooling effort for same output power
Enables higher system overload conditions
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