Infineon FS1150R08A8P3LMCHPSA1 Half Bridge IGBT, 600 A 750 V, Screw Mount

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TWD38,481.00

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TWD40,405.05

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RS庫存編號:
349-029
製造零件編號:
FS1150R08A8P3LMCHPSA1
製造商:
Infineon
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品牌

Infineon

Maximum Continuous Collector Current

600 A

Maximum Collector Emitter Voltage

750 V

Maximum Gate Emitter Voltage

±20V

Number of Transistors

6

Maximum Power Dissipation

1 kW

Configuration

Half Bridge

Mounting Type

Screw Mount

Channel Type

N

COO (Country of Origin):
DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.

Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology

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