Nexperia 200 V 1.4 A Rectifier & Schottky Diode Hyperfast Recovery 2-Pin SOD-323 PNE20010EXDX
- RS庫存編號:
- 260-4732
- 製造零件編號:
- PNE20010EXDX
- 製造商:
- Nexperia
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 25 件）*
TWD170.00
(不含稅)
TWD178.50
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 50 件從 2026年4月27日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 25 - 25 | TWD6.80 | TWD170.00 |
| 50 - 75 | TWD6.50 | TWD162.50 |
| 100 - 475 | TWD6.30 | TWD157.50 |
| 500 - 1975 | TWD6.00 | TWD150.00 |
| 2000 + | TWD5.70 | TWD142.50 |
* 參考價格
- RS庫存編號:
- 260-4732
- 製造零件編號:
- PNE20010EXDX
- 製造商:
- Nexperia
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Nexperia | |
| Mount Type | Surface | |
| Product Type | Rectifier & Schottky Diode | |
| Package Type | SOD-323 | |
| Maximum Continuous Forward Current If | 1.4A | |
| Peak Reverse Repetitive Voltage Vrrm | 200V | |
| Series | PNE20010EXD | |
| Rectifier Type | Hyperfast Recovery | |
| Pin Count | 2 | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 25A | |
| Minimum Operating Temperature | -55°C | |
| Maximum Forward Voltage Vf | 1020mV | |
| Maximum Operating Temperature | 175°C | |
| Peak Reverse Recovery Time trr | 25ns | |
| Height | 0.68mm | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Nexperia | ||
Mount Type Surface | ||
Product Type Rectifier & Schottky Diode | ||
Package Type SOD-323 | ||
Maximum Continuous Forward Current If 1.4A | ||
Peak Reverse Repetitive Voltage Vrrm 200V | ||
Series PNE20010EXD | ||
Rectifier Type Hyperfast Recovery | ||
Pin Count 2 | ||
Peak Non-Repetitive Forward Surge Current Ifsm 25A | ||
Minimum Operating Temperature -55°C | ||
Maximum Forward Voltage Vf 1020mV | ||
Maximum Operating Temperature 175°C | ||
Peak Reverse Recovery Time trr 25ns | ||
Height 0.68mm | ||
Standards/Approvals No | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Nexperia high power density, hyperfast recovery rectifier with high-efficiency planar technology, encapsulated in a CFP2-HP power and flat lead surface-mounted device plastic package.
Planar die design with Pt doped life time control
Low inductance
High power capability due to clip-bond technology
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