Nexperia 200 V 6 A Rectifier & Schottky Diode Hyperfast Recovery 3-Pin SOT PNE20060EPEZ
- RS庫存編號:
- 260-4737
- 製造零件編號:
- PNE20060EPEZ
- 製造商:
- Nexperia
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可享批量折扣
查看批量定價選項小計（1 包，共 25 件）*
TWD505.00
(不含稅)
TWD530.25
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 4,875 件準備從其他地點送貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 25 - 25 | TWD20.20 | TWD505.00 |
| 50 - 475 | TWD19.40 | TWD485.00 |
| 500 - 975 | TWD17.80 | TWD445.00 |
| 1000 - 2475 | TWD15.70 | TWD392.50 |
| 2500 + | TWD13.20 | TWD330.00 |
* 參考價格
- RS庫存編號:
- 260-4737
- 製造零件編號:
- PNE20060EPEZ
- 製造商:
- Nexperia
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Nexperia | |
| Mount Type | Surface | |
| Product Type | Rectifier & Schottky Diode | |
| Package Type | SOT | |
| Maximum Continuous Forward Current If | 6A | |
| Peak Reverse Repetitive Voltage Vrrm | 200V | |
| Rectifier Type | Hyperfast Recovery | |
| Pin Count | 3 | |
| Maximum Forward Voltage Vf | 940mV | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 150A | |
| Minimum Operating Temperature | -55°C | |
| Peak Reverse Recovery Time trr | 14ns | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Height | 0.95mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Nexperia | ||
Mount Type Surface | ||
Product Type Rectifier & Schottky Diode | ||
Package Type SOT | ||
Maximum Continuous Forward Current If 6A | ||
Peak Reverse Repetitive Voltage Vrrm 200V | ||
Rectifier Type Hyperfast Recovery | ||
Pin Count 3 | ||
Maximum Forward Voltage Vf 940mV | ||
Peak Non-Repetitive Forward Surge Current Ifsm 150A | ||
Minimum Operating Temperature -55°C | ||
Peak Reverse Recovery Time trr 14ns | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Height 0.95mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Nexperia high power density, hyperfast switching time recovery rectifier with high-efficiency planar technology, encapsulated in a CFP15B power and flat lead surface mounted device plastic package.
Pt doped life time control
Low inductance
High power capability due to clip-bond technology
Planar die design
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