Nexperia 60 V 1.4 A Rectifier & Schottky Diode Trench Schottky 2-Pin SOD-323
- RS庫存編號:
- 260-4720
- 製造零件編號:
- PMEG60T10ELXD-QX
- 製造商:
- Nexperia
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 卷，共 4500 件）*
TWD16,650.00
(不含稅)
TWD17,460.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年11月02日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 4500 - 4500 | TWD3.70 | TWD16,650.00 |
| 9000 + | TWD3.60 | TWD16,200.00 |
* 參考價格
- RS庫存編號:
- 260-4720
- 製造零件編號:
- PMEG60T10ELXD-QX
- 製造商:
- Nexperia
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Nexperia | |
| Mount Type | Surface | |
| Product Type | Rectifier & Schottky Diode | |
| Package Type | SOD-323 | |
| Maximum Continuous Forward Current If | 1.4A | |
| Peak Reverse Repetitive Voltage Vrrm | 60V | |
| Diode Configuration | Trench Schottky Barrier Rectifier | |
| Rectifier Type | Trench Schottky | |
| Pin Count | 2 | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 27A | |
| Maximum Forward Voltage Vf | 640mV | |
| Minimum Operating Temperature | -55°C | |
| Peak Reverse Current Ir | 0.4mA | |
| Maximum Operating Temperature | 175°C | |
| Peak Reverse Recovery Time trr | 4ns | |
| Standards/Approvals | AEC-Q101 | |
| Automotive Standard | AEC-Q101 | |
| 選取全部 | ||
|---|---|---|
品牌 Nexperia | ||
Mount Type Surface | ||
Product Type Rectifier & Schottky Diode | ||
Package Type SOD-323 | ||
Maximum Continuous Forward Current If 1.4A | ||
Peak Reverse Repetitive Voltage Vrrm 60V | ||
Diode Configuration Trench Schottky Barrier Rectifier | ||
Rectifier Type Trench Schottky | ||
Pin Count 2 | ||
Peak Non-Repetitive Forward Surge Current Ifsm 27A | ||
Maximum Forward Voltage Vf 640mV | ||
Minimum Operating Temperature -55°C | ||
Peak Reverse Current Ir 0.4mA | ||
Maximum Operating Temperature 175°C | ||
Peak Reverse Recovery Time trr 4ns | ||
Standards/Approvals AEC-Q101 | ||
Automotive Standard AEC-Q101 | ||
- COO (Country of Origin):
- MY
The Nexperia trench schottky barrier rectifier encapsulated in a CFP2-HP power flat lead surface mounted device plastic package.
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
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