Nexperia 200 V 1 A Rectifier & Schottky Diode General-Purpose Rectification 2-Pin SOD-323
- RS庫存編號:
- 260-4729
- 製造零件編號:
- PNE20010EXD-QX
- 製造商:
- Nexperia
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可享批量折扣
查看批量定價選項小計（1 卷，共 4500 件）*
TWD15,300.00
(不含稅)
TWD16,065.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年12月16日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 4500 - 4500 | TWD3.40 | TWD15,300.00 |
| 9000 + | TWD3.30 | TWD14,850.00 |
* 參考價格
- RS庫存編號:
- 260-4729
- 製造零件編號:
- PNE20010EXD-QX
- 製造商:
- Nexperia
規格
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法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Nexperia | |
| Product Type | Rectifier & Schottky Diode | |
| Mount Type | Surface | |
| Package Type | SOD-323 | |
| Maximum Continuous Forward Current If | 1A | |
| Peak Reverse Repetitive Voltage Vrrm | 200V | |
| Series | PNE20010EXD-Q | |
| Rectifier Type | General-Purpose Rectification | |
| Pin Count | 2 | |
| Peak Reverse Current Ir | 5μA | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 25A | |
| Minimum Operating Temperature | -55°C | |
| Maximum Forward Voltage Vf | 1020mV | |
| Peak Reverse Recovery Time trr | 25ns | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | AEC-Q101 | |
| Height | 0.68mm | |
| Automotive Standard | AEC-Q101 | |
| 選取全部 | ||
|---|---|---|
品牌 Nexperia | ||
Product Type Rectifier & Schottky Diode | ||
Mount Type Surface | ||
Package Type SOD-323 | ||
Maximum Continuous Forward Current If 1A | ||
Peak Reverse Repetitive Voltage Vrrm 200V | ||
Series PNE20010EXD-Q | ||
Rectifier Type General-Purpose Rectification | ||
Pin Count 2 | ||
Peak Reverse Current Ir 5μA | ||
Peak Non-Repetitive Forward Surge Current Ifsm 25A | ||
Minimum Operating Temperature -55°C | ||
Maximum Forward Voltage Vf 1020mV | ||
Peak Reverse Recovery Time trr 25ns | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals AEC-Q101 | ||
Height 0.68mm | ||
Automotive Standard AEC-Q101 | ||
- COO (Country of Origin):
- MY
The Nexperia high power density, hyperfast recovery rectifier with high-efficiency planar technology, encapsulated in a CFP2-HP power and flat lead Surface-mounted device plastic package.
Planar die design with Pt doped life time control
Low inductance
High power capability due to clip-bond technology
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