Silicon Labs EFR32FG25A221F1920IM56-B RF Transceiver IC, 56-Pin QFN-56
- RS庫存編號:
- 270-0507
- 製造零件編號:
- EFR32FG25A221F1920IM56-B
- 製造商:
- Silicon Labs
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可享批量折扣
小計（1 件）*
TWD411.00
(不含稅)
TWD431.55
(含稅)
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單位 | 每單位 |
|---|---|
| 1 - 9 | TWD411.00 |
| 10 - 24 | TWD373.00 |
| 25 - 49 | TWD365.00 |
| 50 - 99 | TWD357.00 |
| 100 + | TWD351.00 |
* 參考價格
- RS庫存編號:
- 270-0507
- 製造零件編號:
- EFR32FG25A221F1920IM56-B
- 製造商:
- Silicon Labs
規格
產品概覽和技術數據資料表
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Silicon Labs | |
| Technology | ARM Cortex | |
| Product Type | RF Transceiver IC | |
| Modulation Technique | FSK | |
| Sub Type | Sub-GHz Wireless SoC | |
| Data Rate | 2.4Mbps | |
| Package Type | QFN-56 | |
| Pin Count | 56 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 470MHz | |
| Minimum Supply Voltage | 1.71V | |
| Operating Band 2 Frequency | 920MHz | |
| Maximum Supply Voltage | 3.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Series | EFR32FG25 | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Number of Operating Bands | 2 | |
| 選取全部 | ||
|---|---|---|
品牌 Silicon Labs | ||
Technology ARM Cortex | ||
Product Type RF Transceiver IC | ||
Modulation Technique FSK | ||
Sub Type Sub-GHz Wireless SoC | ||
Data Rate 2.4Mbps | ||
Package Type QFN-56 | ||
Pin Count 56 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 470MHz | ||
Minimum Supply Voltage 1.71V | ||
Operating Band 2 Frequency 920MHz | ||
Maximum Supply Voltage 3.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Series EFR32FG25 | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
Number of Operating Bands 2 | ||
- COO (Country of Origin):
- TW
The Silicon Labs EFR32FG25 gecko SoC is an Ideal solution for sub-GHz Wi-SUN applications for metering, lighting, and distribution automation. The high-performance sub-GHz radio provides long range and is not susceptible to 2.4 GHz interference from technologies like Wi-Fi. The single die, multi-core solution, provides industry leading security, high throughput, and an integrated power amplifier to enable the next level of secure connectivity for IoT devices.
Integrated PA with up to 16 dBm (SubGHz) TX power
Robust peripheral set and up to 37 GPIO
Operation up to 125 °C
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