Silicon Labs EFR32FG25B221F1920IM56-B RF Transceiver IC, 56-Pin QFN-56
- RS庫存編號:
- 270-0518
- 製造零件編號:
- EFR32FG25B221F1920IM56-B
- 製造商:
- Silicon Labs
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小計(1 件)*
TWD425.00
(不含稅)
TWD446.25
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 200 件準備從其他地點送貨
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單位 | 每單位 |
|---|---|
| 1 - 9 | TWD425.00 |
| 10 - 24 | TWD416.00 |
| 25 - 49 | TWD407.00 |
| 50 - 99 | TWD400.00 |
| 100 + | TWD392.00 |
* 參考價格
- RS庫存編號:
- 270-0518
- 製造零件編號:
- EFR32FG25B221F1920IM56-B
- 製造商:
- Silicon Labs
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Silicon Labs | |
| Technology | ARM Cortex | |
| Product Type | RF Transceiver IC | |
| Sub Type | Sub-GHz Wireless SoC | |
| Modulation Technique | FSK | |
| Data Rate | 2400kbps | |
| Package Type | QFN-56 | |
| Pin Count | 56 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 470MHz | |
| Operating Band 2 Frequency | 920MHz | |
| Minimum Supply Voltage | 1.71V | |
| Maximum Supply Voltage | 3.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Series | EFR32FG25 | |
| Standards/Approvals | RoHS | |
| Number of Operating Bands | 2 | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Silicon Labs | ||
Technology ARM Cortex | ||
Product Type RF Transceiver IC | ||
Sub Type Sub-GHz Wireless SoC | ||
Modulation Technique FSK | ||
Data Rate 2400kbps | ||
Package Type QFN-56 | ||
Pin Count 56 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 470MHz | ||
Operating Band 2 Frequency 920MHz | ||
Minimum Supply Voltage 1.71V | ||
Maximum Supply Voltage 3.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Series EFR32FG25 | ||
Standards/Approvals RoHS | ||
Number of Operating Bands 2 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- TW
The Silicon Labs EFR32FG25 gecko SoC is an Ideal solution for sub-GHz Wi-SUN applications for metering, lighting, and distribution automation. The high-performance sub-GHz radio provides long range and is not susceptible to 2.4 GHz interference from technologies like Wi-Fi. The single die, multi-core solution, provides industry leading security, high throughput, and an integrated power amplifier to enable the next level of secure connectivity for IoT devices.
Integrated PA with up to 16 dBm (SubGHz) TX power
Robust peripheral set and up to 37 GPIO
Operation up to 125 °C
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