BGAP2D20AE6327XTSA1 Infineon Pre-Driver for Wireless Infrastructure Applications 35.1 dB, 16-Pin 2700 MHz TSNP-16

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TWD262.00

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TWD275.10

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RS庫存編號:
349-416
製造零件編號:
BGAP2D20AE6327XTSA1
製造商:
Infineon
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品牌

Infineon

Product Type

Pre-Driver for Wireless Infrastructure Applications

Operating Frequency

2700 MHz

Technology

BiCMOS

Gain

35.1dB

Package Type

TSNP-16

Minimum Supply Voltage

4.75V

Maximum Supply Voltage

5.5V

Pin Count

16

Noise Figure

4.7dB

Minimum Operating Temperature

-40°C

Third Order Intercept OIP3

34.3dBm

Maximum Operating Temperature

115°C

Standards/Approvals

RoHS, JEDEC47/20/22

Height

8mm

Automotive Standard

No

COO (Country of Origin):
MY
The Infineon 2.3 to 2.7 GHz low band driver amplifier that can be used as pre driver or driver in RF applications from massive MIMO 5G base stations to small cells and access points. The driver amplifier is typically placed between transceiver IC and power amplifier but can also be used as power amplifier for low power applications. The input is 100Ω differential, the output is 50Ω single ended.

100Ω differential input

5V supply voltage

TSNP 16 leadless package

BiCMOS Technology

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