Infineon TLE75080ESHXUMA1 High Side 2, High Side Power Switch IC 24-Pin, TSDSO

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TWD115,500.00

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TWD121,260.00

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  • 從 2027年7月19日 發貨
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3000 - 12000TWD38.50TWD115,500.00
15000 +TWD37.40TWD112,200.00

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RS庫存編號:
223-8600
製造零件編號:
TLE75080ESHXUMA1
製造商:
Infineon
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品牌

Infineon

Product Type

Power Switch IC

Power Switch Type

High Side

Power Switch Topology

High Side

Switch On Resistance RdsOn

2.2Ω

Number of Outputs

8

Number of Inputs

2

Interface Type

SPI

Mount Type

Surface

Minimum Supply Voltage

3V

Package Type

TSDSO

Maximum Supply Voltage

28V

Pin Count

24

Operating Current

330mA

Maximum Operating Temperature

150°C

Minimum Operating Temperature

-40°C

Length

8.65mm

Height

1.15mm

Width

6mm

Standards/Approvals

No

Series

SPIDER

Automotive Standard

AEC

Infineon SPIDER Series Power Switch IC, 28V Maximum Supply Voltage, 24 Pin Count - TLE75080ESHXUMA1


This power switch IC is a high-side automotive power distribution device designed for SPI control in vehicle systems. It offers multiple controlled outputs for switching loads within a 3-28V supply range and is intended for surface-mounted installation in automotive-grade applications operating across a broad temperature range.

Features and Benefits:


• 8 outputs delivering centralised load switching capability
• SPI Interface enabling serial control of outputs
• 2.2Ω low RdsOn reducing conduction losses
• 0.33A operating current suitable for moderate loads
• AEC automotive qualification for vehicle-grade deployment
• -40 to150°C rated operation for extreme environments

Applications


• Suitable for decentralised body control modules
• Ideal for multiplexed lighting and signalling systems
• Used for controlled switching in power distribution units
• Can be used for fan or pump load management
• Used with microcontrollers for gated power sequencing

How many control inputs are provided for monitoring or control?


It incorporates two inputs that can be used for external sensing or control signalling.

What is the package pin count and mounting style?


The device is supplied in a 24-pin TSD SO package intended for surface-mount assembly.

What are the physical height and footprint constraints for PCB layout?


The component has a height of 1.15 mm and a footprint measuring 8.65 x 6 mm, aiding Compact board designs.

What topology does the device use for switching and thermal performance?


It employs a high-side switch topology compatible with automotive power architectures and supports high operating temperatures.

What supply voltage limits should be observed during design?


Design should accommodate a minimum supply of 3 V and a maximum supply of 28 V when integrating the device.

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