Vishay 4.7 μF Surface Mount Polymer Capacitor, 6.3V dc
- RS庫存編號:
- 860-3878
- 製造零件編號:
- T55J475M6R3C0500
- 製造商:
- Vishay
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 10 件）*
TWD87.00
(不含稅)
TWD91.40
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每包* |
|---|---|---|
| 10 - 990 | TWD8.70 | TWD87.00 |
| 1000 - 1990 | TWD8.50 | TWD85.00 |
| 2000 + | TWD8.30 | TWD83.00 |
* 參考價格
- RS庫存編號:
- 860-3878
- 製造零件編號:
- T55J475M6R3C0500
- 製造商:
- Vishay
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Vishay | |
| Technology | Polymer | |
| Product Type | Polymer Capacitor | |
| Capacitance | 4.7μF | |
| Voltage | 6.3V dc | |
| Mount Type | Surface Mount | |
| Package/Case | 0603 | |
| Polarity | Polar | |
| Tolerance | ±20 % | |
| Maximum Operating Temperature | 105°C | |
| Dimensions | 1.6 x 0.8 x 0.8 mm | |
| Depth | 0.8mm | |
| Length | 1.6mm | |
| Height | 0.8mm | |
| Series | T55 | |
| Electrolyte Type | Solid | |
| Automotive Standard | No | |
| Leakage Current | 10μA | |
| Minimum Operating Temperature | -55°C | |
| Dissipation Factor | 10% | |
| Ripple Current | 0.32A | |
| 選取全部 | ||
|---|---|---|
品牌 Vishay | ||
Technology Polymer | ||
Product Type Polymer Capacitor | ||
Capacitance 4.7μF | ||
Voltage 6.3V dc | ||
Mount Type Surface Mount | ||
Package/Case 0603 | ||
Polarity Polar | ||
Tolerance ±20 % | ||
Maximum Operating Temperature 105°C | ||
Dimensions 1.6 x 0.8 x 0.8 mm | ||
Depth 0.8mm | ||
Length 1.6mm | ||
Height 0.8mm | ||
Series T55 | ||
Electrolyte Type Solid | ||
Automotive Standard No | ||
Leakage Current 10μA | ||
Minimum Operating Temperature -55°C | ||
Dissipation Factor 10% | ||
Ripple Current 0.32A | ||
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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