Vishay 15 μF Surface Polymer Capacitor, 4V dc
- RS庫存編號:
- 173-3674
- 製造零件編號:
- T55P156M004C0200
- 製造商:
- Vishay
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可享批量折扣
查看批量定價選項小計（1 卷，共 3000 件）*
TWD20,400.00
(不含稅)
TWD21,420.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年10月19日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 3000 - 12000 | TWD6.80 | TWD20,400.00 |
| 15000 + | TWD6.70 | TWD20,100.00 |
* 參考價格
- RS庫存編號:
- 173-3674
- 製造零件編號:
- T55P156M004C0200
- 製造商:
- Vishay
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Vishay | |
| Technology | Polymer | |
| Product Type | Polymer Capacitor | |
| Capacitance | 15μF | |
| Voltage | 4V dc | |
| Mount Type | Surface | |
| Package/Case | 2012-12 | |
| Polarity | Polar | |
| Tolerance | ±20 % | |
| Maximum Operating Temperature | 105°C | |
| Dimensions | 2 x 1.25 x 1.2 mm | |
| Series | T55 | |
| Length | 2mm | |
| Depth | 1.25mm | |
| Height | 1.2mm | |
| Electrolyte Type | Solid | |
| Minimum Operating Temperature | -55°C | |
| Automotive Standard | No | |
| Leakage Current | 10μA | |
| Ripple Current | 0.56A | |
| Dissipation Factor | 10% | |
| 選取全部 | ||
|---|---|---|
品牌 Vishay | ||
Technology Polymer | ||
Product Type Polymer Capacitor | ||
Capacitance 15μF | ||
Voltage 4V dc | ||
Mount Type Surface | ||
Package/Case 2012-12 | ||
Polarity Polar | ||
Tolerance ±20 % | ||
Maximum Operating Temperature 105°C | ||
Dimensions 2 x 1.25 x 1.2 mm | ||
Series T55 | ||
Length 2mm | ||
Depth 1.25mm | ||
Height 1.2mm | ||
Electrolyte Type Solid | ||
Minimum Operating Temperature -55°C | ||
Automotive Standard No | ||
Leakage Current 10μA | ||
Ripple Current 0.56A | ||
Dissipation Factor 10% | ||
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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