Phoenix Contact DD31H 2 Series PCB Connector, 16-Contact, 3.81 mm Pitch, Snap-in, 2 Row Crimp

小計(1 包,共 50 件)*

TWD6,797.00

(不含稅)

TWD7,136.85

(含稅)

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RS庫存編號:
492-871
製造零件編號:
1340721
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Product Type

PCB Connector

Number of Contacts

16

Pitch

3.81mm

Number of Rows

2

Current

8A

Mount Type

Snap-in

Housing Material

Polybutylene Terephthalate

Connector Gender

Male

Colour

Black

Termination Type

Crimp

Voltage

160V

Series

DD31H 2

Depth

17.78mm

Width

44.62mm

Standards/Approvals

IEC 60512-5-1:2002-02, ISO 6988:1985-02, IEC 60068-2-70:1995-12, IEC 60068-2-6:2007-12, IEC 60512-1-1:2002-02, IEC 60512-13-5:2006-02, DIN EN 61984, IEC 60512-1-2:2002-02, IEC 60512-13-2:2006-02, IEC 60664-1:2007-04, IEC 60512-3-1:2002-02, IEC 60512-9-1:2010-03, UL Recognised Approval ID: E118976-20240617

Length

33.6mm

COO (Country of Origin):
CN
The Phoenix Contact PCB Connector is engineered for efficient and reliable connectivity in compact electronic applications. Featuring a double-row design, it allows for high packing density while maintaining a small footprint, making it ideal for situations where space is a premium. The innovative crimp connection method ensures robust electrical performance, supporting a nominal current of 8 A and rated voltage of 160 V. Constructed with high-quality materials including a reliable Sn contact surface and durable PBT housing, this connector promises longevity and susceptibility to environmental factors. Designed with an intuitive snap-in locking mechanism, it prevents accidental disconnection, providing peace of mind in operational settings. Whether used in industrial applications or consumer electronics, this connector meets stringent standards and offers proven reliability.

Compact design enhances spatial efficiency in various applications

Snap in locking mechanism guarantees secure connections

Crimp connection method allows for quick and hassle free assembly

Constructed with high quality materials that ensure durability

Ideal for large volume applications with cost effective connectivity

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