Molex Micro-Fit Series Right Angle Through Hole PCB Header, 12 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 205-1067
- 製造零件編號:
- 212528-1200
- 製造商:
- Molex
可享批量折扣
小計（1 件）*
TWD74.00
(不含稅)
TWD77.70
(含稅)
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- 加上 394 件從 2026年2月23日 起發貨
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單位 | 每單位 |
|---|---|
| 1 - 9 | TWD74.00 |
| 10 - 49 | TWD72.00 |
| 50 + | TWD71.00 |
* 參考價格
- RS庫存編號:
- 205-1067
- 製造零件編號:
- 212528-1200
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 12 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Current 12.5A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 12 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Row Pitch 3mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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