Molex Micro-Fit Series Right Angle Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 205-1056
- 製造零件編號:
- 212528-0200
- 製造商:
- Molex
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 5 件）*
TWD242.00
(不含稅)
TWD254.10
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 4,195 件從 2025年12月29日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 45 | TWD48.40 | TWD242.00 |
| 50 - 120 | TWD47.60 | TWD238.00 |
| 125 - 245 | TWD46.40 | TWD232.00 |
| 250 + | TWD45.60 | TWD228.00 |
* 參考價格
- RS庫存編號:
- 205-1056
- 製造零件編號:
- 212528-0200
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit | |
| Pitch | 3mm | |
| Current | 12.5A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 2 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| Distrelec Product Id | 304-39-596 | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series Micro-Fit | ||
Pitch 3mm | ||
Current 12.5A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 2 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Voltage 600 V | ||
Distrelec Product Id 304-39-596 | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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