Molex 3099 Series Vertical Through Hole PCB Header, 7 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 787-519
- 製造零件編號:
- 22-15-2076
- 製造商:
- Molex
N
小計（1 托盤，共 400 件）*
TWD13,627.00
(不含稅)
TWD14,308.35
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD13,627.00 | TWD34.068 |
* 參考價格
- RS庫存編號:
- 787-519
- 製造零件編號:
- 22-15-2076
- 製造商:
- Molex
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 3099 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Housing Material | Nylon | |
| Number of Contacts | 7 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 3099 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Housing Material Nylon | ||
Number of Contacts 7 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Constructed with high-quality materials for durability and longevity
Provides excellent electrical performance with minimal signal loss
Supports a variety of configurations to meet diverse connectivity needs
Designed to withstand challenging environmental conditions
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