Molex 3099 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 787-514
- 製造零件編號:
- 22-14-2104
- 製造商:
- Molex
N
小計（1 托盤，共 200 件）*
TWD10,123.00
(不含稅)
TWD10,629.15
(含稅)
訂單超過 $1,300.00 免費送貨
新產品 - 立即預訂
- 從 2026年11月09日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD10,123.00 | TWD50.615 |
* 參考價格
- RS庫存編號:
- 787-514
- 製造零件編號:
- 22-14-2104
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | 3099 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Number of Contacts | 10 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series 3099 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Number of Contacts 10 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex PCB Header is designed for reliable and efficient electrical connections in various applications. They ensure secure connections between circuit boards and other devices.
Available in multiple standards for flexibility in design
Optimised for high-performance environments to enhance reliability
Facilitates easy assembly and maintenance, reducing downtime
Offers diverse configurations to meet specific connectivity needs
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