Phoenix Contact MCDN Series Straight Wave Soldering Mount PCB Header, 30 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 556-625
- 製造零件編號:
- 1953842
- 製造商:
- Phoenix Contact
小計（1 包，共 40 件）*
TWD39,817.00
(不含稅)
TWD41,807.85
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月17日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
包 | 每包 | 每單位* |
|---|---|---|
| 1 + | TWD39,817.00 | TWD995.425 |
* 參考價格
- RS庫存編號:
- 556-625
- 製造零件編號:
- 1953842
- 製造商:
- Phoenix Contact
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Phoenix Contact | |
| Series | MCDN | |
| Product Type | PCB Header | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | COMBICON FMC 1 | |
| Mount Type | Wave Soldering Mount | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Row Pitch | 3.5mm | |
| Tail Pin Length | 2.6mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 100°C | |
| Standards/Approvals | cULus Recognised, VDE approval of drawings | |
| Mating Pin Length | 2.6mm | |
| Voltage | 160 V | |
| 選取全部 | ||
|---|---|---|
品牌 Phoenix Contact | ||
Series MCDN | ||
Product Type PCB Header | ||
Current 8A | ||
Pitch 3.5mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System COMBICON FMC 1 | ||
Mount Type Wave Soldering Mount | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Row Pitch 3.5mm | ||
Tail Pin Length 2.6mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 100°C | ||
Standards/Approvals cULus Recognised, VDE approval of drawings | ||
Mating Pin Length 2.6mm | ||
Voltage 160 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header offers an advanced solution for connecting multiple circuits seamlessly. Engineered for integration into the SMT soldering process, this versatile component is designed to meet the demanding needs of modern electronic devices. Its compact structure allows for a high contact density while maintaining a robust performance across a variety of applications. With features tailored for through-hole reflow technology, the product’s reliability is underscored by its rich specifications, making it an ideal choice for manufacturers seeking efficiency and effectiveness. The reliable connection ensures optimal functionality, while its carefully selected materials guarantee compliance with international standards, catering to both performance and environmental considerations.
Designed for flexible device integration with various connection technologies
Facilitates higher contact density through multi-level conductor connection
Optimised for both reflow and wave soldering techniques
Lightweight design contributes to easier handling and assembly
RoHS-compliant, ensuring environmental sustainability
Features linear pinning for enhanced stability during operation
Accommodates a diverse range of applications within electronic circuitry
Superior electrical properties enhance overall performance
Packaging is efficient, minimising waste and supporting eco-friendly practices
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