Phoenix Contact MCDN Series Wave Soldering Mount PCB Header, 20 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 558-031
- 製造零件編號:
- 1749528
- 製造商:
- Phoenix Contact
小計（1 包，共 130 件）*
TWD9,078.00
(不含稅)
TWD9,531.90
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月11日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
包 | 每包 | 每單位* |
|---|---|---|
| 1 + | TWD9,078.00 | TWD69.831 |
* 參考價格
- RS庫存編號:
- 558-031
- 製造零件編號:
- 1749528
- 製造商:
- Phoenix Contact
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Phoenix Contact | |
| Series | MCDN | |
| Product Type | PCB Header | |
| Pitch | 3.81mm | |
| Current | 8A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Wave Soldering Mount | |
| Connector System | COMBICON FMC 1 | |
| Contact Plating | Nickel, Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3.81mm | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Tail Pin Length | 2.6mm | |
| Maximum Operating Temperature | 100°C | |
| Standards/Approvals | cULus Recognised, VDE approval of drawings | |
| Mating Pin Length | 2.6mm | |
| Voltage | 160 V | |
| 選取全部 | ||
|---|---|---|
品牌 Phoenix Contact | ||
Series MCDN | ||
Product Type PCB Header | ||
Pitch 3.81mm | ||
Current 8A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Wave Soldering Mount | ||
Connector System COMBICON FMC 1 | ||
Contact Plating Nickel, Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3.81mm | ||
Termination Type Solder | ||
Contact Gender Male | ||
Tail Pin Length 2.6mm | ||
Maximum Operating Temperature 100°C | ||
Standards/Approvals cULus Recognised, VDE approval of drawings | ||
Mating Pin Length 2.6mm | ||
Voltage 160 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header is meticulously designed for seamless integration into the SMT soldering processes, ensuring reliability and efficiency in electronic connections. This component boasts a flexible design that accommodates various connection technologies, allowing for greater versatility in device architecture. With a robust construction featuring a nominal current of 8 A and a rated voltage of 160 V, it provides dependable performance across multiple applications. The through-hole reflow technology enhances assembly precision, while the compact dimensions ensure ease of installation without compromising on quality. This product is an ideal solution for engineers seeking to optimise space and contact density in their designs.
Integrates effortlessly with SMT soldering processes for enhanced efficiency
Offers flexibility for various connection technologies in device design
Enables high contact density through multi-level conductor connections
Presents a compact footprint, allowing for space-efficient applications
Manufactured from high-quality materials ensuring durability and reliability
Complies with WEEE/RoHS for environmentally-friendly operation
Designed for effective thermal management during the soldering process
Tested for a wide temperature range, suitable for diverse operational environments
Features multiple rows and potential connections for versatile circuit options
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